Ch-technology VS207LM..CS02CB Series Manual do Utilizador descarregar pdf (Página 3)

www.vishay.com For technical questions, contact: die-wafer@vishay.com

Document Number: 93889

2 Revision: 31-Mar-08

VS207LM..CS02CB Series

Vishay High Power Products

Fast Recovery Diodes

ORDERING INFORMATION TABLE

Device code

1 - Vishay HPP device

- Chip dimension in mils

3 - Type of device: L = Wire bondable fast recovery diode

4 - Passivation process: M = Glassivated MOAT

- Voltage code x 100 = V

RRM

- Metallization: C = Aluminum (anode) - silver (cathode)

7 -t

code: S02 = 200 ns

8 - CB = Probed uncut die (wafer in box)

None = Probed die in chip carrier

Available class

02 = 200 V

04 = 400 V

06 = 600 V

51324678

VS 207 L M 06 C S02 CB

LINKS TO RELATED DOCUMENTS

Dimensions http://www.vishay.com/doc?95156

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Ch-technology VS207LM..CS02CB Series Manual do Utilizador Página 3